UPD70F3556AM1GMA1-GBK-E2-AX

UPD70F3556AM1GMA1-GBK-E2-AX
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Part Number UPD70F3556AM1GMA1-GBK-E2-AX
LIXINC Part # UPD70F3556AM1GMA1-GBK-E2-AX
Manufacturer Renesas Electronics America
Category Integrated CircuitsEmbedded - Microcontrollers
Description IC MCU 32BIT 1MB FLASH 176HLQFP
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models UPD70F3556AM1GMA1-GBK-E2-AX PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Oct 21 - Oct 25 2024(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

UPD70F3556AM1GMA1-GBK-E2-AX Specifications

Part Number:UPD70F3556AM1GMA1-GBK-E2-AX
Brand:Renesas Electronics America
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Integrated Circuits
Subcategory:Embedded - Microcontrollers
Manufacturer:Renesas Electronics America
Series:V850E2/Fx4
Package:Tray
Part Status:Obsolete
Core Processor:V850E2
Core Size:32-Bit
Speed:80MHz
Connectivity:CANbus, CSI, I²C, LINbus, UART/USART
Peripherals:DMA, PWM, WDT
Number of I/O:136
Program Memory Size:1MB (1M x 8)
Program Memory Type:FLASH
EEPROM Size:32K x 8
RAM Size:80K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 40x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 110°C (TA)
Mounting Type:Surface Mount
Package / Case:176-LQFP Exposed Pad
Supplier Device Package:176-HLQFP (24x24)

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